CVC DC Sputterer
The CVC DC sputterer is used to coat samples with metals.
-wafers/substrates up to 6"
-new touchscreen control system
-two 3" and two 8" sputter guns
-rotostrate for improved uniformity
-base pressure 5e-6 Torr
You must first log in to see the status.
- Charlie Suh
Cleanroom - Pettit
CapabilitiesDeposition - Metal Deposition - Aluminum
Deposition - Metal Deposition - Chromium
Deposition - Metal Deposition - Copper
Deposition - Metal Deposition - Gold
Deposition - Metal Deposition - Iron
Deposition - Metal Deposition - Nickel
Deposition - Metal Deposition - Palladium
Deposition - Metal Deposition - Platinum
Deposition - Metal Deposition - Ruthenium
Deposition - Metal Deposition - Silver
Deposition - Metal Deposition - Tanatalum
Deposition - Metal Deposition - Titanium
Deposition - Metal Deposition - Tungsten
General Equipment Specification - Sputterer Systems
Shared DriveNo share drive for this equipment.
Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS) To schedule time on equipment within SUMS browse to https://sums.gatech.edu/Department/IEN log in, search for equipment, and click & drag to schedule time.
Equipment with Similar Capabilities
The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating ions or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. -Sputter two or more dissimilar materials simultaneously for complete control of film stoichiometry (co-deposition) -Max RF power 325W -Integrated touch screen control -Single substrate up to 12" diameter -Multiple substrate up to 4" diameter -Substrate fixture rotation up to 20rpm
Cleanroom - Marcus Inorganic
The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. -Process wafers up to 4" -Deposition Processes: Aluminum, Aluminum/Silicon, Gold, Titanium, Copper, Chromium, Molybdenum, Molybdenum/Copper, Nickel, Silicon, Tantalum -DC/RF power
Cleanroom - Marcus Inorganic
Standard Recipes and Reports
You must first log in to see the standard recipe files.
User Shared Files
You must first log in to see shared files.
You are billed the cleanroom hourly rate when logged into this tool, even if you are not logged into a cleanroom.
See our rates for more information.
You must first log in to see service requests for the CVC DC Sputterer.
You must first log in to see the equipment log for the CVC DC Sputterer.
Training SessionsTraining for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS) To get trained for the Cleanrooms, or equipment within the IEN department simply browse to http://sums.gatech.edu/Department/IEN Log in with your Georgia Tech username and password, then browse to the IEN Equipment Group page to learn new training info.