SEC 850 Flip-chip Bonder
The SEC850 is an easy-to-use manual flip-chip bonding/placement system. The placement accuracy of this machine is +/- 24um (X-Y). -substrate heater is capable of up to ~260C -die size down to 0.5mmx0.5mm -substrate size up to 4inx4in
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Packaging Research Center
Shared DriveNo share drive for this equipment.
Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS) To schedule time on equipment within SUMS browse to https://sums.gatech.edu/Department/IEN log in, search for equipment, and click & drag to schedule time.
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Standard Recipes and Reports
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User Shared Files
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Training SessionsTraining for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS) To get trained for the Cleanrooms, or equipment within the IEN department simply browse to http://sums.gatech.edu/Department/IEN Log in with your Georgia Tech username and password, then browse to the IEN Equipment Group page to learn new training info.