Finetech Sub-micron Flip-chip Bonder
The Finetech Fineplacer Lambda is a very high precision flip-chip bonder that has the following features: -heating/cooling profile up to 400C -bond gap control -better than 0.5micron accuracy in X/Y axes -intuitive operation -side view camera -substrate size up to 4" wafer -chip size from less than 1x1mm to 60x60mm -bond force 0.1 - 20N (0.1N resolution)
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Lab - Pettit 160
Shared DriveNo share drive for this equipment.
Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS) To schedule time on equipment within SUMS browse to https://sums.gatech.edu/Department/IEN log in, search for equipment, and click & drag to schedule time.
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Standard Recipes and Reports
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User Shared Files
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Training SessionsTraining for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS) To get trained for the Cleanrooms, or equipment within the IEN department simply browse to http://sums.gatech.edu/Department/IEN Log in with your Georgia Tech username and password, then browse to the IEN Equipment Group page to learn new training info.