Oxford ICP PECVD
The Oxford ICP (Inductively Coupled Plasma) PECVD deposits a high-density, thin film under low temperatures and pressures (10mTorr or less). Instead of having parallel electrodes, this ICP PECVD has coiled electrodes, which results in high-density film. Only 4" wafers are allowed in this system.
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- Tran-Vinh Nguyen
Cleanroom - Marcus Inorganic
CapabilitiesDeposition - Dielectrics Deposition - Silicon Nitride
Deposition - Dielectrics Deposition - Silicon Oxide
General Equipment Specification - PECVD Systems
Shared DriveAccess Shared Drive
Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS) To schedule time on equipment within SUMS browse to https://sums.gatech.edu/Department/IEN log in, search for equipment, and click & drag to schedule time.
Equipment with Similar Capabilities
No similar equipment.
Standard Recipes and Reports
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User Shared Files
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Training SessionsTraining for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS) To get trained for the Cleanrooms, or equipment within the IEN department simply browse to http://sums.gatech.edu/Department/IEN Log in with your Georgia Tech username and password, then browse to the IEN Equipment Group page to learn new training info.