Plasma-Therm PECVD


A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has two chambers. -Operates at 13.56 MHz -Sample size: pieces to 6" wafers -Typical deposition rates: 100 angstrom/min - 400 angstrom/min -Typical processes: Silicon Dioxide, Silicon Nitride, Silicon Oxynitride


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Cleanroom - Pettit


General Equipment Specification - PECVD Systems

Shared Drive

No share drive for this equipment.


Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS)
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Cleanroom - Marcus Inorganic

Standard Recipes and Reports

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User Shared Files

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Billing Rates

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Service Requests

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Equipment Log

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Training Sessions

Training for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS)
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The IEN has cleanrooms in the Pettit Microelectronics Research building and the Marcus Nanotechnology Research building. Learn More

Georgia Tech Institute for Electronics and Nanotechnology

The Institute for Electronics and Nanotechnology (IEN) is a Georgia Tech interdisciplinary research institute designed to enhance support for rapidly growing research programs spanning biomedicine, materials, electronics and nanotechnology. Learn More

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Marcus Nanotechnology Research Center
Georgia Institute of Technology
345 Ferst Drive NW
Atlanta, GA 30318
(404) 894-5100
Pettit Microelectronics Research Building
Georgia Institute of Technology
791 Atlantic Drive
Atlanta, Ga 30332
(404) 894-5100