Hydrofluoric (HF) Vapor Etcher
The Hydrofluoric Vapor Etcher is used for the removal of oxide layers on samples. It has high etch rates and is very selective against silicon. This etcher works entirely in the vapor phase, allowing it to prevent movable structures from sticking to the substrate. Its heater design results in great uniformity because it reduces temperature gradients.
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- Hang Chen
Cleanroom - Marcus Inorganic
CapabilitiesEtch - Dielectrics - Silicon Oxide
Shared DriveNo share drive for this equipment.
Equipment access control, scheduling, and training is now managed within the Shared User Management System (SUMS) To schedule time on equipment within SUMS browse to https://sums.gatech.edu/Department/IEN log in, search for equipment, and click & drag to schedule time.
Equipment with Similar Capabilities
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Standard Recipes and Reports
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User Shared Files
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There are no hourly rates for this equipment. You will only be charged for cleanroom time.
See our rates for more information.
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Training SessionsTraining for the IEN Cleanrooms is now managed within the Shared User Management System. (SUMS) To get trained for the Cleanrooms, or equipment within the IEN department simply browse to http://sums.gatech.edu/Department/IEN Log in with your Georgia Tech username and password, then browse to the IEN Equipment Group page to learn new training info.