Equipment

Abrasive Blast Cabinet

This cabinet is used to roughen samples for adhesive promotion or material removal. It is to be used with electronic substrates, but not for rust removal of bulk metal parts. The abrasive media is very soft.

Location

Assembly Lab

ALD1

The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD1 uses water and trimethylaluminum precursor gases and pulses each with a N2 purge following each pulse. Each cycle of precursors deposits a single atomic layer of Al2O3 (1.0-1.1 angstrom/cycle) via two half-reactions. This tool is set up to deposit only Al2O3 to minimize cross-contamination. <br> <br> Specifications:<br> wafer pieces up to 6" wafer<br> 25C-250C<br> 5mT base pressure

Location

Cleanroom - Marcus Inorganic

ALD2

The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD2 uses 4 precursor gases and pulses each with a N2 purge following each pulse. Each cycle of gases deposits an atomic layer of material via typically two half-reactions. The tool is currently set up to deposit Al2O3, HfO2, and Er2O3. <br> <br> Specifications:<br> wafer pieces up to 6" wafer<br> 25C-250C<br> base pressure 5mT<br>

Location

Cleanroom - Marcus Inorganic

AMSCOPE IN300TB Inverted Microscope

Inverted compound microscope for observation of biological cultures or specimens within well plates, petri dishes, or vials that require a longer working distance Trinocular head with Siedentopf binocular mount, interchangeable pairs of 10x and 20x high-eyepoint super-widefield eyepieces, 50 to 75mm interpupillary adjustment, and fixed 45-degree vertical inclination; vertical port accepts C-Mount or 23mm camera (sold separately) Under-mounted quadruple nosepiece with 4x, 10x (phase-contrast), 20x (phase-contrast), and 40x DIN long working-distance plan objectives that provide a longer working distance and improved focus over the entire viewing field Upper-mounted rheostat-controlled 30W halogen illumination and movable 0.3 NA Abbe condenser for clear examination and light control Oversize double-layer mechanical stage with 1.0mm stage divisions and 0.1mm vernier resolution locks slide into place and provides precise slide manipulation along the X- and Y-axis; with coaxial coarse and fine focus

Location

Cleanroom - Marcus Organic

BGA Rework Station

This tool is used to rework soldered flip chips. It has rough alignment and placement capabilities and can heat a substrate for assembly or disassembly of flip chips.

Location

Assembly Lab

Biacore T200 SPR

Biacore T200 is a versatile, label-free system for studies of biomolecular interactions. Obtain high quality kinetics from the fastest on-rates to slowest off-rate Analyze interactions involving the smallest low molecular weight compounds.

Location

Cleanroom - Marcus Organic

Bioforce Nano eNabler Printer/Patterner

The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtoliter volumes of biomolecules, nanoparticles and other liquids onto a wide variety of surfaces. It is faster and more flexible than conventional technologies, and has no clogging or misalignment problems, as well as multiplexing ability. -Spot and line sizes: 1 to 30 microns -100 msec printing cycle -20 nm stage resolution -50 mm XY travel -Multiplexing ability. -Accommodates samples up to 4 inches

Location

Cleanroom - Marcus Organic

Bio Lion XC-530 Centrifuge

This all purpose low speed centrifuge is quiet, compact, and convenient which makes it ideal for any lab. With swing bucket rotors that can accommodate up to 50mL tubes, this versatile centrifuge can be used in applications for clinical and surgical uses. Product Features LED Screen Brushless Motor Low Maintenance Programmable Comes with balance control, lid lock, and temperature/speed protection devices Automatic RCF Display

Location

Cleanroom - Marcus Organic

Black Magic PECVD

AIXTRON’s PECVD system uses rapid heating and plasma technologies that have been proven in the field since 2005 and has enabled customers to produce various types of nanotubes, including low temperature multiwall, singlewall and supergrowth nanotubes for 4" substrates.

Location

Cleanroom - Marcus Inorganic

BLE Spinner

The BLE Photoresist Spinner is a spinner/hot plate combo mounted inside of a white polypropylene body. This is a fully manual spinner accustomed for use with 4” or 6” wafers (or pieces mounted on a 4” carrier) only. This spinner is self-exhausted and has readily available workspace and a programmable hotplate.

Location

Cleanroom - Marcus Inorganic

Bowoptic Stress Measurement

The BowOptic 208 is an automatic wafer stress measurement machine that uses a proven accurate method to measure wafer stress. Wafers sizes up to 8” can be loaded onto the chuck. The wafer moves automatically into the tool for precision measurement.

Location

Cleanroom - Marcus Inorganic

BSA Chuck Checkout

Back Side Alignment Chuck Checkout

Location

Cleanroom - Pettit

Cambridge NanoTech Plasma ALD - Metal (left)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-high aspect ratio features. Film thickness can be controlled to within 1nm.<br> <br> Specifications:<br> -Dual chamber w/ load-locks<br> -Chuck temperature from RT to 500C<br> -RF Plasma (up to 300W)<br> -Up to 8" (200mm) wafer, maximum 0.20in/5mm thick<br> -Auto-logs run data (pressure, temp, etc)<br> <br> Materials available (as of 11/4/15):<br> Al2O3<br> AlN<br> ZnO<br>

Location

Cleanroom - Marcus Inorganic

Cambridge NanoTech Plasma ALD - Oxide (right)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-high aspect ratio features. Film thickness can be controlled to within 1nm. <br> <br> Specifications:<br> -Dual chamber w/ load-locks<br> -Chuck temperature from RT to 500C<br> -RF Plasma (up to 300W)<br> -Up to 8" (200mm) wafer, maximum 0.20in/5mm thick<br> -Auto-logs run data (pressure, temp, etc)<br> <br> Materials available (as of 10/10/14):<br> Al2O3<br> HfO2<br> SiO2<br> ZrO2<br> TiO2<br> TiN<br> AlN<br> HfN<br> ZrN<br>

Location

Cleanroom - Marcus Inorganic

CHA E-beam Evaporator 1 (dielectrics)

The e-beam evaporator will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate (anisotropic).<br><br> -Used to deposit dielectrics<br> -Low Process Pressure

Location

Cleanroom - Marcus Inorganic

CHA E-beam Evaporator 2 (metals)

The e-beam evaporator will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate.<br><br> -Used to deposit metal<br> -Low Process Pressure

Location

Cleanroom - Marcus Inorganic

Cleanroom User Forum - Fall Series

A series of open dates allowing cleanroom users the chance to discuss their equipement and processing issues with the technical staff members responsible for the upkeep and performance of the cleanrooms. All forums will be held in Rm. 102a on the following dates: 10/26/2015 Mon (High Temperature Processing) 11/2/2015 Mon (General Cleanroom Discussion) 11/12/2015 Thu (Metalization) 11/24/2015 Fri (Photolithography) 12/3/2015 Thu (General Cleanroom Discussion)

Location

Lab - Pettit 1st Floor

CMOS Boat Checkout

This is an access controlled storage for the CMOS Teflon/PFA wafer boat. The CMOS wafer boat is strictly used for CMOS purposes only and is should not contact metal surfaces or other metal contamination.

Location

Cleanroom - Pettit

CMOS Cleaning Station (Marcus)

This fume hood has heated tanks: Piranha, SC2 cleans and dilute HF etch tank. These wet baths are only available for use for CMOS-qualified processes with approved process flows. Only 4" and 6" wafers are allowed in this system.

Location

Cleanroom - Marcus Inorganic

CMOS Cleaning Station (Pettit)

This fume hood has heated tanks: Piranha, SC1, SC2 cleans and Nitride etch tank. These wet baths are only available for use for CMOS-qualified processes with approved process flows. Only 4" and 6" wafers are allowed in this system.

Location

Cleanroom - Pettit

CMOS Spin Rinse Dryer (Inorganic)

Spin Rinse Dryer (SRD) is used for rinsing and drying full sized wafers in cassette, after cleaning process in CMOS Wet Bench. The SRD can hold white 4” and 5" wafer cassettes. No metal or broken wafers.

Location

Cleanroom - Marcus Inorganic

CMOS Spin Rinse Dryer - Pettit

The spin-rinse-dryer is equipped for cleaning 4-inch silicon wafers. It spins the wafers and uses deionized water and nitrogen to clean and dry the wafers.

Location

Cleanroom - Pettit

Contact Angle Measurement System

The Ramé-hart Model 250 goniometer is a software-driven instrument providing automated digital contact angle measurements. This instrument has been furnished with a 4” rotating wafer support stage and automated tilting base option. The Model 250 is also a tensiometer and has an advanced software version for surface energy measurements as well as surface tension and dynamic studies. Advancing and receding contact angles are readily determined by inclining the substrate and allowing the drop to deform as a function of gravity.

Location

Cleanroom - Marcus Organic

Cressington 108A Carbon Coater

The Cressington 108A Carbon Coater is typically used for coating SEM samples with less than 20nm uniform coating of conductive carbon. Once pumped down to operating vacuum pressures, a high current is passed through 2 carbon rods. An arc will occur at the point which the 2 rods touch and result in a sputtering-type deposition of carbon. The process, including pump-down, deposition and vent requires approximately 1 minute.

Location

Marcus Microscopy 1

CVC DC Sputterer

The CVC DC sputterer is used to coat samples with metals. <br> <br> Specifications:<br> -wafers/substrates up to 6"<br> -new touchscreen control system<br> -two 3" and two 8" sputter guns<br> -rotostrate for improved uniformity<br> -base pressure 5e-6 Torr

Location

Cleanroom - Pettit

CVC E-Beam Evaporator 1

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. <br> <br> -Typical deposition rates range from <1 A/sec to 3 A/sec.

Location

Cleanroom - Pettit

CVC E-Beam Evaporator 2 -- Instructional Center

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. -Typical deposition rates range from <1 angstroms/sec to 3 angstroms/sec.

Location

Cleanroom - Pettit

CVD FirstNano Graphene Furnace 1

The CVD FirstNano Graphene furnace is currently configured for graphene on Cu foil, graphene sublimation from SiC samples (epitaxial graphene), and H2 etch clean of samples. Samples are heated via 10kW RF induction heating.<br> <br> Specifications:<br> -quartz chamber with graphite susceptor<br> -3in wafer and small pieces<br> -2200C max<br> -fully programmable<br> -turbo pump for low pre-processing base pressure (9.0e-7 Torr)<br> -Ar, H2, SiH4, CH4<br> <br> (keywords: silicon carbide growth materials)

Location

Cleanroom - Marcus Inorganic

CVD FirstNano Graphene Furnace 2

The CVD FirstNano Graphene 2 is currently configured to grow graphene on Cu foil samples. Samples are heated via infrared lamps from top and bottom. A turbo pump and load-lock allows for low base pressure and thus low back-ground O2 contamination. <br> <br> Specifications:<br> 1150C max<br> 4" wafer and small pieces<br> SiH4, H2, Ar, NH3<br> Base pressure 1e-7 Torr<br> <br> (keywords: growth materials copper)

Location

Cleanroom - Marcus Inorganic

CVD FirstNano SiGe Nanowire Furnace

The SiGe Nanowire furnace is configured for depositing Si nanowires from metal nanoparticles such as Au. Substrate material is typically Si. Samples are heated via infrared lamps from top and bottom. <br> <br> Specifications:<br> 350C - 900C<br> SiH4, H2, Ar, Ge, 0.1% PH3<br> base pressure 1e-3 Torr<br> <br> (keywords: silicon germanium growth materials IR)

Location

Cleanroom - Marcus Inorganic

Dage Shear Tester

The Dage Shear Tester is used primarily to test flip chip bonds by shearing off the bonded die. This can be a destructive or non-destructive test.

Location

Assembly Lab

Dage X-Ray XD7600NT

The Dage X-Ray XD7600NT provides the highest resolution and largest X-ray images for failure analysis with oblique angle views up to 70 degrees, displayed at full 2 Mpixel resolution on screen. -750nm (0.75 micron) feature recognition -Revolutionary ‘filament-free’ Dage NT X-ray tube -AXIS – Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sample

Location

Lab - Pettit 160

Dektak 150 Profilometer

The Veeco Dektak 150 is a surface profilometer (by stylus contact) capable of down to 4 angstrom step height measurement. This profilometer is comparable to the Tencor P15 Profilometers in performance and operation.<br> <br> Specifications:<br> -1mm max step height<br> -automated X and Y stage<br> -up to 6" (150mm) wafer<br> -stylus force down to 0.5 mg<br>

Location

Cleanroom - Marcus Inorganic

Dektak 150 Profilometer -- Instructional Center

The Veeco Dektak 150 is a surface profilometer (by stylus contact) capable of down to 4 angstrom step height measurement. This profilometer is comparable to the Tencor P15 Profilometers in performance and operation.<br> <br> Specifications:<br> -1 mm max step height<br> -automated X and Y stage<br> -up to 6" (150mm) wafer<br> -stylus force down to 1mg<br>

Location

Cleanroom - Pettit

Denton Discovery 2

The Denton Discovery 2 is an RF/DC sputterer capable of high temperature processing and RF bias on the platen. It currently has 4 guns, 3 of which are RF and 1 DC.<br> <br> Specifications:<br> -turbo and cryo pumped (5e-6 Torr)<br> -sample heater 600C max

Location

Cleanroom - Marcus Inorganic

Denton Discovery - RF/DC Sputterer

The Denton Discovery RF/DC Sputterer is configured for thin film deposition of up to 4 materials sequentially without breaking vacuum. The system is equipped with two 3" DC target positions and two 3” RF targets. Target #3 is dual power and can run either DC or RF power.<br> <br> Specifications:<br> -load-lock for fast pumpdown<br> -base pressure below 9e-7 Torr<br> -computer controlled

Location

Cleanroom - Marcus Inorganic

Denton Explorer - E-beam Evaporator

The Denton Explorer is a six pocket e-beam evaporator system used to coat samples with various metals and dielectrics. A high-intensity beam of electrons is focused on the center of a crucible containing the material to be evaporated. <br> <br> Features: <br> * Computer-controlled deposition<br> * Better than 3 x 10-6 Torr base pressure<br> * 0.5 - 5A/sec deposition rates<br> * Quartz crystal sensor deposition rate control<br> * 6-pocket source for Ti, Cr, Ni, Fe, Al, Cu, Pt, Au, SiO2, Al2O3

Location

Cleanroom - Marcus Inorganic

Denton Infinity

The Denton Infinity is a six pocket e-beam evaporator system used to coat samples with various metals. A high-intensity beam of electrons is focused on the center of a crucible containing the material to be evaporated. <br> <br> Features: <br> * Computer-controlled deposition<br> * Better than 3 x 10-6 Torr base pressure<br> * 0.5 - 5A/sec deposition rates<br> * Quartz crystal sensor deposition rate control<br> * 6-pocket source for Ti, Cr, Ni, NiFe, Cu, Fe<br> * A heater source capable of going up to 250C

Location

Cleanroom - Marcus Inorganic

Dicing Saw

The IEN Dicing Saw is capable of dicing wafers up to 6" in diameter. It can cut a variety of materials including silicon, glass, silicon carbide, sapphire, and quartz. Depending on the material, thicknesses of samples can range between 200um to 3mm, and die sizes can range from 1mm x 1mm up to cutting the sample in half. Samples must be cut all the way across.

Location

Cleanroom - Pettit

EBL CEE Spinner

<a href="/processing/shipley/">Shipley Co., Inc. Photoresists</a><br> <a href="/processing/az/">AZ Electronic Materials Photoresists</a><br> <a href="/processing/futurrex/">Futurrex, Inc. Photoresists</a>

Location

Cleanroom - Pettit

EVG 101 Spin Coater

The EVG101 Spin Coater is a teflon body, automatic Shipley 1827 resist spin coater. It offers further functionality allowing users to cast photoresist through a syringe pump or manually. The spin coater is also self-cleaning and can be configured for edge bead rinse and backside rinse.

Location

Cleanroom - Marcus Inorganic

EVG 620 Mask Aligner

The EVG 620 Mask aligner is configured for top and backside alignment. It has a manual cassette load with UV400 exposure optics (365nm) and 10x objective lens. The alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.

Location

Cleanroom - Marcus Inorganic

FEI Nova Nanolab 200 FIB/SEM

The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool. It combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition. It extends your applications range for nanoscale prototyping, machining, 2D and 3D-characterization and analysis. -Resolution @ 30 kV STEM- 1.0nm -Resolution @ 5 kV (TLD-SE)- 2.0nm -Minimum deposition line width: 20 nm -Minimum etched Si line width: <15nm Go here for more info on the Nova Nanolab 200 http://www.fib2center.chemistry.gatech.edu/index.html Radiation Safety Form (Please fill out after every use): goo.gl/rqfZl

Location

Marcus Microscopy 1

FEI Quanta 200 3D FIB/SEM

The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron Microscopy (SEM) with Focused Ion Beam (FIB) to extend application ranges for 3D characterization and nanoanalysis. It allows charge-free imaging of a non-conductive specimen through its variable pressure vacuum system (ESEM) and gas chemistries for high-volume milling. Allows for:<br> <br> -Crack tip 3D reconstruction<br> -Revealing sub-surface cause of surface defects on finished metal surfaces<br> -Characterization of strained materials along orthogonal sections<br> -Resolution of 3.5nm @ 30kV @ high vacuum<br> -5 axis motorized stage<br> -379 mm wide chamber<br> Go here for more info on the Quanta 200:<br> http://www.fib2center.chemistry.gatech.edu/index.html<br>

Location

Lab - Pettit 1st Floor

Finetech Sub-micron Flip-chip Bonder

The Finetech Fineplacer Lambda is a very high precision flip-chip bonder that has the following features: -heating/cooling profile up to 400C -bond gap control -better than 0.5micron accuracy in X/Y axes -intuitive operation -side view camera -substrate size up to 4" wafer -chip size from less than 1x1mm to 60x60mm -bond force 0.1 - 20N (0.1N resolution)

Location

Lab - Pettit 160

FTIR Spectrometer

The Thermo Scientific Nicolet iS50 FT-IR spectrometer gives definitive answers in your analytical workload. The iS50 enables users of various skill levels to obtain results at the push of a button in applications ranging from drug and polymer development to forensic analysis and art conservation. Features: ~ 0.09 cm-1 resolution with variable aperture ~ Touch Point one-touch sampling operation ~ Gold optics ~ Fixed, single position source and detector mirrors ~ DLaTGS Detector with KBr window ~ Ge on KBr beamsplitter ~ Long Lifetime Polaris™ Infrared Source ~ High speed USB 2.0 interface ~ Upgradeable to include iS50 ATR Built-in, wide range diamond ATR ~ Accepts all Smart Accessories and many others ~ Expandable with the iS50 GC-IR and iS50 NIR modules ~ Compatible with Continuum FT-IR Microscope and TGA Accessory ~ Ready for iS50 ABX automatic beamsplitter changer ~ Without iS50 ABX: Internal storage for 2 additional beamsplitters ~ Internal Validation wheel for SPV or ValPro Qualifications included ~ Includes NIST Traceable Polystyrene and NG11 Glass ~ Sealed and Desiccated with KBr sample compartment windows

Location

Cleanroom - Marcus Organic

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Cleanroom - Marcus Inorganic

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Cleanroom - Marcus Inorganic

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Cleanroom - Marcus Inorganic

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Cleanroom - Marcus Inorganic

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Cleanroom - Marcus Inorganic

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Cleanroom - Marcus Inorganic

Gasonics Asher

The Aura 1000 Asher is a microprocessor controlled downstream photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. It is also able to function as a descummer by removing approximately 200-500 angstroms of photoresist. The Asher can remove a maximum of one micron of photoresist.

Location

Cleanroom - Pettit

Gasonics Asher (Inorganic)

The Aura 1000 Asher is a microprocessor controlled downstream, or "afterglow", photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute.

Location

Cleanroom - Marcus Inorganic

Heraeus Vacuum Oven - Inorganic

The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C under vacuum. The oven can be programmed to ramp, dwell, and cool down due to the user's specifications. The vacuum pressure for this oven (top oven) under nitrogen atmosphere can be controlled using a throttle-valve and nitrogen MFC.

Location

Cleanroom - Marcus Inorganic

Heraeus Vacuum Oven - Pettit

The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C under vacuum. The oven can be programmed to ramp, dwell, and cool down due to the user's specifications.

Location

Cleanroom - Pettit

Hermes LS500XL CO2 laser

Hermes LS500XL 60 watt CO2 laser.The Gravograph LS-500XL CO2 laser produces a beam of infrared light with its principal wavelength centering around 10.6 microns. The typical beam size is approximately 200 microns, and the working area is 18 x 12 inches. Materials such as polymers (acrylic, polyester, mylar, parylene, PMMA, PLA...), quartz, fused silica, organics (wood, fabric,...) are suitable for laser machining with material thicknesses ranging from 0.05 to 10 mm.

Location

Lab - Pettit 161

High Speed Optical Signal Testing

This test-bed is capable of testing high-speed optical signal and provide high precision bit-error-rate estimation.

Location

GEDC

Hitachi HD-2700 200kV STEM

The Hitachi HD-2700 200kV STEM can image samples at 80kV, 120kV, and 200kV. It has a unique secondary electron detector - simultaneous HAADF, BF, and SE imaging along with EDX. Lattice resolution - including a SE resolution of 0.3nm - can be achieved quickly, given proper sample preparation.

Location

Marcus Microscopy 4

Hitachi HT7700 TEM

The HT7700 is a highly advanced Transmission Electron Microscope developed for imaging both biological and nano-material specimens. The long focal length setting is for low magnification and high contrast (HC) imaging. The short focal length setting is for high magnification and high resolution (HR) imaging. The TEM utilizes modern computer control and digital cameras to enhance user-friendliness. Standard TEM grid sizes are a 3.05 mm diameter ring and has to have a thickness of less than 100 nm. Applications: >TEM operation and viewing are integrated into user interface, allowing for operation of the TEM in ambient room lighting. >A high sensitivity digital screen camera allows for effortless viewing of samples even at ultra-low intensities on the LCD monitor. >Hitachi’s unique Double-gap objective lens provides high contrast, high resolution, low magnification and wide field of view imaging modes. Specifications: > Accelerating Voltage 40 ~ 120 KV >Resolution (lattice) 0.2 nm (100KV) >Magnification x200 ~ x200,000 (HC mode) x4,000 ~ x600,000 (HR mode)

Location

Marcus Microscopy 1

Hitachi S-3500H SEM

The Hitachi 3500H series scanning electron microscope offers high resolution imaging in a vacuum.

Location

Lab - Pettit 160

Hitachi S-3700N VP-SEM

The Hitachi S-3700N Variable Pressure SEM features a low vacuum observation of 6–270 Pa (7mT-2Torr) which enables imaging of non-conductive samples (dielectrics) and wet/moist samples such as cultured cells, without traditional sample preparation (gold coating/drying). A Deben Coolstage controls sample temperature between -10F and 120F to control sample vapor pressure. <br> <br> -Magnification range: x5 – x300,000<br> -Resolution @ 30kV (SE in High Vacuum Mode): 3nm <br> -Resolution @ 30kV (BSE in 6Pa Low Vacuum Mode): 4nm

Location

Cleanroom - Marcus Organic

Hitachi S-4700 FE-SEM

The Hitachi S-4700 FE-SEM is a cold field emission high resolution scanning electron microscope. This SEM permits ultra high resolution imaging of thin films and semi-conductor materials on exceptionally clean specimens.

Location

Cleanroom - Marcus Inorganic

Hitachi SU8230

Hitachi’s next generation Cold Field Emission SEM offers unmatched low‑voltage imaging and comprehensive analytical microanalysis with the uncompromised performance of CFE. The 8230 FE-SEM employs a novel cold field emission (CFE) gun for improved imaging and analytical performance. The newly designed Hitachi CFE gun complements the inherent high resolution and brightness of conventional CFE with increased probe current and beam stability. New Source and Detection Technology from Hitachi: Increased probe current for S/N and analytical performance Unparalleled imaging throughput with improved CFE beam stability Enhanced deceleration and selective energy filter providing fine contrast differentiation at low accelerating voltages

Location

Marcus Microscopy 4

Hitachi ZoneSEM

Ozone cleaner for sample preparation for the Hitachi SEM

Location

Marcus Microscopy 4

Hitachi ZoneTEM

Ozone cleaner used for sample preparation on the Hitachi TEM

Location

Marcus Microscopy 1

Hummer 5 Gold/Palladium Sputterer

The Hummer Sputtering System is used to prepare non-conductive SEM samples by coating those with Au/Pd.

Location

Cleanroom - Pettit

Hummer 6 Gold/Palladium Sputterer

The Hummer Sputtering System is used to prepare non-conductive SEM samples by coating those with Au/Pd.

Location

Marcus Microscopy 1

Hummer XP Gold Sputterer

The Hummer Sputtering System is used to prepare non-conductive SEM samples by coating those with gold.

Location

Cleanroom - Marcus Inorganic

Hydrofluoric (HF) Vapor Etcher

The Hydrofluoric Vapor Etcher is used for the removal of oxide layers on samples. It has high etch rates and is very selective against silicon. This etcher works entirely in the vapor phase, allowing it to prevent movable structures from sticking to the substrate. Its heater design results in great uniformity because it reduces temperature gradients.

Location

Cleanroom - Marcus Inorganic

Hysitron TriboIndenter

The TriboIdenter is used to measure the hardness and elastic modulus of thin films and coatings.

Location

Marcus Microscopy 4

IEN Technical Forum

IEN Technical Forum is designed for cleanroom users and staff to sit down and discuss all processing, equipment related issues. A general topic will be selected for a session but not limited to the topic.

Location

Pettit Classroom Class Entrance

Image Reversal Oven

The image reversal oven exposes the pattern on the resist to ammonia vapor, reversing the pattern on the mask material (e.g. certain photoresists). The temperature control is adjustable.

Location

Cleanroom - Marcus Inorganic

IONTOF Time-of-Flight SIMS

The ToF-SIMS system uses Bi ions to directly chemically image surfaces. Sputtering by O or Cs ion beams allows depth profiles up to ~ 1 micron. Atomic masses from 1 up to >5000 amu (i.e. H up to large molecules) can be detected with a high mass resolution. The system can detect trace elements down to concentrations of a few parts per million. The software can produce 2-D and 3 -D chemical reconstructions of analyzed areas. Lateral resolution is as small as ~300 nm, vertical resolution is ~ 2nm.

Location

Marcus Microscopy 1

JEOL JBX-9300FS EBL System

An electron beam lithography system which has a specified resolution of 20 nm at 100 pA beam current. The system can pattern a wide variety of substrate sizes and can align to pre-existing patterns. </br> </br> 4 nm diameter Gaussian spot electron beam</br> 50 kV/100 kV accelerating voltage</br> 50 pA - 100 nA current range</br> 50 MHz scan speed</br> +/- 100 um vertical range automatic focus</br> +/- 2 mm vertical range manual focus</br> ZrO/W thermal field emission source</br> vector scan for beam deflection</br> small pieces (3x5 mm) up to max 300 mm (12") wafers with 9" of writing area</br> 20 nm line width writing at 100kV</br> 20 nm field stitching accuracy at 100kV</br> 25 nm overlay accuracy at 100 kV</br>

Location

Cleanroom - Pettit

JetLabII Ink-jet Printer

This table-top ink-jet microdispensing and printing platform is useful for a wide variety of applications. Typical inks include polymers, adhesives, metallic nanoparticles, and biological materials, including diagnostic reagents, proteins, and DNA. As a non-contact printing process, the accuracy of ink-jet dispensing is not affected by how the fluid wets a substrate, and the fluid source cannot be contaminated by materials on the substrate. In addition, the ability to free-fly fluid droplets allows the fluid to be dispensed into and onto non-planar and complex structural features.

Location

Cleanroom - Marcus Organic

Karl Suss MA-6 Mask Aligner - Inorganic

Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate. The MA-6 can handle wafers up to 6" in size, and is optimized for 435 nm wavelength.

Location

Cleanroom - Marcus Inorganic

Karl Suss MA-6 Mask Aligner - Instructional Center

Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate. The MA-6 can handle wafers up to 6" in size, and is optimized for 435 nm wavelength.

Location

Cleanroom - Pettit

Karl Suss MA-6 Mask Aligner - Pettit

Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate. The MA-6 can handle wafers up to 6" in size, and is optimized for 435 nm wavelength.

Location

Cleanroom - Pettit

Karl Suss RC8 Spinner - Inorganic

The RC8 programmable process spinner is reserved for photoresist use. Spin coatings of other materials must be done with the SCS spinners. Photoresist coatings are usually performed with the CEE 100CB spin coaters. This spinner is capable of processing up to 6" wafers, has motorized and programmable position dispense arm, maximum speed of 5,000 rpm and an acceleration of 100 to 5000 rpm/s.

Location

Cleanroom - Marcus Inorganic

Karl Suss RC8 Spinner - Pettit

The RC8 programmable process spinner is reserved for photoresist use. Spin coatings of other materials must be done with the SCS spinners. Photoresist coatings are usually performed with the CEE 100CB spin coaters. This spinner is capable of processing up to 6" wafers, has motorized and programmable position dispense arm, maximum speed of 5,000 rpm and an acceleration of 100 to 5000 rpm/s.

Location

Cleanroom - Pettit

Karl Suss SB6 Bonder

The SB6 is a semiautomatic, computer controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. It can be used for most substrate bond processes, with high alignment accuracy and precision.

Location

Cleanroom - Marcus Inorganic

Karl Suss SB8E Bonder

The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. It has the capabilities for anodic, silicon fusion, adhesive, and thermal compression bonding for wafers that are up to 6".

Location

Cleanroom - Marcus Inorganic

Karl Suss TSA MA-6 Mask Aligner

The Karl Suss TSA MA6 Mask Aligner offers high quality exposure optics for high resolution and optimum edge quality with 0.2 micron top alignment resolution. This mask aligner offers accurate and precise gap settings for high yield and contains high intensity light sources that reduce process time. It is optimized for top size alignment (TSA) and is capable of processing up to 6"/150mm wafers. The components consist of UV250 optics and monitor and Olympus 5x, 10x, and 20x objectives lenses.

Location

Cleanroom - Marcus Inorganic

Keyence VHX-600 Digital Microscope

The Keyence VHX-600 Digital Microscope is an advanced visible light microscope with the following advantages:<br> <br> -3D topography mapping of features down to a few microns (retains color due to visible light)<br> -stereoscope magnification of 20x-2500x<br> -auto focus for magnifications of 250-2500x<br> -54megapixel 3CCD camera<br> -low-mag lens tilts 180 degrees (20x-250x)<br> -low-mag lens is detachable for viewing very large samples<br> -combines up to 50 depths of field to produce completely in-focus image at high magnification<br> -advanced image processing for enhancing bumps/edges<br> -advanced brightness control<br> -intuitive distance/perimeter/area/angle measurement

Location

Marcus Microscopy 2

Location

Marcus Microscopy 2

K&S 1472 Wire Bonder 1

The K&S 1472 is a wedge wire bonder. The system is currently configured for aluminum wire. The bonder can be operated in semi-automatic or fully automatic modes.

Location

Lab - Marcus Lapper & Polishing Room

K&S 1472 Wire Bonder 2

The K&S 1472 is a wedge wire bonder. The system is currently configured for aluminum wire. The bonder can be operated in semi-automatic or fully automatic modes.

Location

Lab - Marcus Lapper & Polishing Room

K&S 4522 Ball Bonder

Semi automatic gold ball wire bonder. Currently set up with 25 um gold wire with a ball size of about 80um.

Location

Assembly Lab

K&S 4523A Wedge Wire Bonder

Aluminum wire wedge bonder. Provides digital controls with semiautomatic bonding cycle, but manual alignment.

Location

Assembly Lab

K&S 4523 Ball Wire Bonder

For process development, production, research or added manufacturing support, K&S 4500 Series Manual Ball Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications.

Location

Assembly Lab

K&S Manual Wire Bonder Pettit 160

25 micron gold ball wirebonder

Location

Lab - Pettit 160

Location

-

Laurell Spinner

Laurell Spinner (Marcus Inorganic CR) used mainly for PZT and other ferroelectric spin-coating.<br> <a href="/processing/shipley/">Shipley Co., Inc. Photoresists</a><br> <a href="/processing/az/">AZ Electronic Materials Photoresists</a><br> <a href="/processing/futurrex/">Futurrex, Inc. Photoresists</a>

Location

Cleanroom - Marcus Inorganic

LEO 1530 FE-SEM

The LEO 1530 FE-SEM is a hi-resolution SEM capable of sub-nanometer resolution. Detectors: In-Lens, SE, and BSE -capable of up to 6" wafer -operational voltage 0.2-30kV -low voltage for viewing non-conductive samples -x/y/z axes motorized stage

Location

Cleanroom - Pettit

Lesker E-beam Evaporator - Soft-Lithography

This manual Kurt J. Lesker E-beam Evaporator is available for depositing materials such as Cu, Ni, and Au for the soft-lithography (ex. microfluidics) lab located in the Marcus Organic cleanroom.

Location

Cleanroom - Marcus Organic

LFE Barrel Etcher

To be filled out by Jie Xu

Location

Cleanroom - Marcus Organic

Lindberg Furnace 1 (CMOS Sintering Tube)

The Lindberg furnace tube 1 is used for curing polymers, sintering, and growing oxides and nitrides on silicon wafers.<br> <br> *Max temperature: 1100C<br> *Nitrogen<br> *Forming Gas (10% H2 in Nitrogen)<br>

Location

Cleanroom - Pettit

Lindberg Furnace 2 (Polymer Curing Tube)

The Lindberg furnace tube 2 is used for curing polymers, sintering, and growing oxides and nitrides on silicon wafers.<br> <br> *Max temperature: 1100C<br> *Nitrogen

Location

Cleanroom - Pettit

Lindberg Furnace 3 (Oxidation Tube)

The Lindberg furnace tube 3 is used for curing polymers, sintering, and wet/dry oxidation and nitrides on silicon wafers.<br> <br> *Max temperature: 1100C<br> *Oxygen

Location

Cleanroom - Pettit

Lindberg Furnace 4 (Polymer Curing Tube)

The Lindberg furnace tube 4 is used for curing polymers, sintering, and growing oxides and nitrides on silicon wafers.<br> <br> *Max temperature: 1100C<br> *Nitrogen

Location

Cleanroom - Pettit

Logitech LP50 Lapper

A three workstation machine, with integral abrasive autofeed system, integral vacuum system, and automatic lapping plate flatness control. The LP50 provides an extremely precise, versatile lapping and polishing capability for production and research.

Location

Lab - Marcus Lapper & Polishing Room

Logitech PM5 Polisher 1

The PM5 is designed for small scale materials processing and is highly flexible in use, allowing it to work with many different materials.

Location

Lab - Marcus Lapper & Polishing Room

Logitech SS Bonder

A Wax bonder to secure wafers to a glass carrier as a preparation step for lapping and polishing.

Location

Lab - Marcus Lapper & Polishing Room

MakerBot Replicator 3D Printer

This equipment can be used to print 3D part models. This equipment uses PLA plastic. Must attend training and obtain authorization. Files can be imported via USB stick or the computer.

Location

Cleanroom - Marcus Organic

Malvern Zetasizer

The Malvern Instruments Zetasizer Nano ZS uses light scattering techniques to measure hydrodynamic size, zeta potential and molecular weight of proteins and nanoparticles ranging from 0.3nm-10um in diameter.

Location

Cleanroom - Marcus Organic

Manual Flip Chip Bonder

This flip chip bonder is currently only for PRC use. It can perform thermocompression, thermosonic, and reflow bonding with up to 20N of force. It can align with a 1 micron accuracy, and handle substrates up to 10mm in size.

Location

Assembly Lab

MEMS Boat Checkout

This is an access controlled storage of the MEMS bench Teflon/PFA wafer boat. This wafer boat is not to be mixed with the CMOS process or any other general processing outside of the MEMS bench.

Location

Cleanroom - Pettit

MEMS Spin Rinse Dryer

The MEMS Spin Rinse Dryer is located next to the MEMS wet bench in Plasma processing bay in Pettit. It is currently configured for 6" wafer cassettes.

Location

Cleanroom - Pettit

MEMS Wet Bench

MEMS wet bench.

Location

Cleanroom - Pettit

Microfuge 18 Micro-centrifuge

Microfuge 18 Micro-centrifuge

Location

Cleanroom - Marcus Organic

Location

Cleanroom - Pettit

Microscope 2 - Instructional Center

The time limit on this machine is one hour.

Location

Cleanroom - Pettit

Microscope 4 - IR (infrared)

Olympus IR microscope is uses IR imaging for alignment, identification of substrate contamination and critical dimension inspections. Objective lenses for this microscope consist of 10x, 20x, 50x, and 100x. The time limit on this machine is one hour.

Location

Cleanroom - Pettit

Microscope M1

Microscope M1 (Olympus MX61) allows for great image resolution and clarity with the use of the Pixelink imaging software. This microscope has capabilities of brightfield, darkfield and optical path settings to allow for the best exposure of substrates. The objective lenses consist of 5x, 10x, 20x, 50x and 100x. The stage is built for both coarse and fine stage movements using a clutch handle. Image acquisition, specialized image processing, measurement functions, statistical outputs, annotation and report generation are all useful capabilities that this microscope offers.

Location

Cleanroom - Marcus Inorganic

Microscope M2

Microscope M2 (Olympus MX61) allows for great image resolution and clarity with the use of the Stream Essentials imaging software. This microscope has capabilities of brightfield, darkfield and optical path settings to allow for the best exposure of substrates. The objective lenses consist of 5x, 10x, 20x, 50x and 100x. The stage is built for both coarse and fine stage movements using a clutch handle. Image acquisition, specialized image processing, measurement functions, statistical outputs, annotation and report generation are all useful capabilities that this microscope offers.

Location

Cleanroom - Marcus Inorganic

Microscope M3 - Soft-lithography

High-resolution, reflected-light, optical microscope for 6-inch wafer inspection. In addition to brightfield and darkfield, the microscope offers linearly polarized light and Nomarski DIC (differential interference contrast) sample inspections.

Location

Cleanroom - Marcus Organic

Microscope M4

IC inspection microscope configured for brightfield, darkfield, and DIC observation of 200mm wafers, motorized 6-place nosepiece with CFI LU Plan BD 5x/10x/20x/50x/100x objectives.

Location

Cleanroom - Marcus Inorganic

Microscope M5

Microscope M5 (Nikon L200) allows for great image resolution and clarity with the use of the imaging software. This microscope has capabilities of brightfield and darkfield settings to allow for the best exposure of substrates. The objective lenses consist of 5x, 10x, 20x, 50x and 100x. The stage is built for both coarse and fine stage movements using a clutch handle. Image acquisition, specialized image processing, measurement functions, statistical outputs, annotation and report generation are all useful capabilities that this microscope offers.

Location

Cleanroom - Marcus Inorganic

Microscope P1

The time limit is one hour.

Location

Cleanroom - Pettit

Microscope P2

The time limit on this machine is one hour.

Location

Cleanroom - Pettit

Microscope P3

Left Stereoscope in Class 10 Photolithography Bay.

Location

Cleanroom - Pettit

Microscope P4

Microscope in the Class 10 Photolithography Bay.

Location

Cleanroom - Pettit

Microscope P5

Stereoscope microscope in Class 10 Photolithography Bay.

Location

Cleanroom - Pettit

Microscope - Soft-lithography

Microscope in Marcus Organic Suite 2

Location

Cleanroom - Marcus Organic

Microtech Laserwriter LW405

The LaserWriter system by MICROTECH is designed for the definition of planar geometries and for surface diagnostics, in applications where maximum resolutions down to 0.7 µm are required. The system transforms a laser beam into a controlled writing tool for photolithographic mask fabrication or for direct in situ processing on planar substrates. Besides microlithographic applications, its optical apparatus and substrate motion management are also well suited for surface inspection or diagnostics. Hence, the same machine can be used first for producing a pattern and later for inspecting the results. The patterns are generated by accurately moving the target (mask or substrate) underneath a focused and scanning laser beam with proper wavelength. The performance and cost of the system are optimised for research and development or small/medium productions. http://www.microtechweb.com/2d/lw_specs.htm

Location

Cleanroom - Marcus Inorganic

Millimeter-Wave Test-Bed

This test-bed is capable of providing very high-precision semi-automatic on-wafer characterization including accommodating a full 12” wafer for DC-to-110GHz small-signal s-parameters, V-band (50GHz~75GHz) & W-band (75GHz~110GHz) large-signal/noise/load-pull measurements. The semi-automatic probe station cascade S-300 has a fully equipped thermal characterization capability for temperature ranges -40oC ~ +90oC with completely enclosed chamber. Circuit designs in millimeter-wave frequency bands (30GHz~300GHz) are difficult and challenging due to numerous unseen effects, which become more and more dominant as the frequency of operation increases beyond 30GHz. The effects of fringing fields, layout parasitic, coupling between passives components, substrate leakage, complicated nonlinear characteristics behavior of active device intrinsic parameters, are some examples of the design challenges that need to be properly addressed in order to predict accurate circuit performances in the millimeter-wave frequency band. This high-precision test-bed guarantees the accuracy and the repeatability of the measurements leading to successful millimeter-wave circuit design for “gigabit wireless communication” applications.

Location

GEDC

Mini Tystar Tube 1

The Mini Tystar 1 is primarily used for wet oxidation at temperatures between 700-1100°C with a flash vaporizer. Batches of 4” silicon wafers (up to 25 wafers) can be processed at the same time, and the oxide uniformity is typically less than 1%.<br> <br> Common recipes:<br> WETOX.001<br> DRYOX.001<br> ANNEAL.001

Location

Cleanroom - Marcus Inorganic

Mini Tystar Tube 2

The Mini Tystar 2 is used for dry and wet oxidation at temperatures between 700-1100°C. Wet oxidation steam is created from the combustion of H2 and O2 (a pyrogenic process). Batches of 4” silicon wafers (up to 25 wafers) can be processed at the same time, and the oxide uniformity is typically less than 1%. <br> <br> Common recipes:<br> WETOX.002<br> DRYOX.002<br> ANNEAL.002

Location

Cleanroom - Marcus Inorganic

Mini Tystar Tube 3

The Mini Tystar 3 is used for low temperature oxidation (LTO) at 725°C and pressure of 300mT. Batches of 4” silicon wafers (up to 25 wafers) can be processed at the same time, and the oxide uniformity is usually less than 3%. <br> <br> Common recipes: <br> TEOS.003<br> STBY.003<br> <br> LTO deposition rate at 12nm/min. Max process temperature is 850C.

Location

Cleanroom - Marcus Inorganic

Location

Lab - Pettit 165

MRL Furnace - Tube 3

MRL Furnace 3 is used for dry oxidation at temperatures between 700 -1150°C. Batches of up to 50 wafers (4 to 8”) can be processed with excellent uniformity (less than 1%).

Location

Cleanroom - Marcus Inorganic

MRL Furnace - Tube 4

MRL Furnace 4 is used for annealing only at temperature between 700-1150°C with batches of up to 50 wafers (4 to 8”).

Location

Cleanroom - Marcus Inorganic

MT Property Tester

MT Property Tester

Location

Cleanroom - Marcus Organic

Nanospec Reflectometer - Inorganic

The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer that is built on a simple-to-use tabletop platform.

Location

Cleanroom - Marcus Inorganic

Nanospec Reflectometer - Pettit

The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer that is built on a simple-to-use tabletop platform.

Location

Cleanroom - Pettit

Necropsy

Necropsy room, no removal.

Location

2nd Floor Computer Lab

Location

Lab - Pettit 1st Floor

Obducat Nano-imprinter (NIL)

Cooling: External Water cooler (<20C)<br> UV Wave-length: 200nm - 1000nm, 1.8W/cm2<br> UV-filter: 250nm - 400nm<br> UV Configuration: One Lamp, pulsed<br> Exposure area: 6 inch<br> Temperature (Max): 300C<br> Pressure (Max): 80 bar (1160 psi)<br> De-molding system: Automatic controlled de-molding (each substrate size needs to be specified)

Location

Cleanroom - Pettit

Olympus DSX-500 digital microscope

olympus digital microscope

Location

-

Olympus LEXT 3D Material Confocal Microscope

Material confocal microscope with fixed laser wavelength of 405nm with magnification ranges: 108x – 17,280x. X-Y plane resolution:~120nm, height resolution:~20-30nm. Measurement modes: profile, area/volume, surface roughness, geometric, film thickness

Location

Cleanroom - Marcus Organic

Location

Cleanroom - Marcus Organic

Olympus MX61 Microscope - Pettit

The MX61 200mm semiconductor inspection microscope has been developed specifically to meet the demands of today’s wafer inspections. The emphasis is on ergonomics and performance to provide the highest productivity and comfort for the operator.

Location

Cleanroom - Pettit

Olympus RU-3 Microspectrophotometer

Olympus RU-3 Microspectrophotometer

Location

-

Oxford Cryogenic ICP

The Oxford Cryogenic ICP (Inductively Coupled Plasma) etching (DRIE) produces high ion densities and hence fast etch rates, while allowing separate control of ion density and ion energy (giving a low damage capability). Wafer clamping and helium back-side cooling is the standard and provides excellent temperature control with the cryogenic to provide a wide temperature range (-150C to 400C). Only 4" wafers are allowed in this system.

Location

Cleanroom - Marcus Inorganic

Oxford End-point RIE

An Oxford Endpoint RIE (Reactive Ion Etcher) system is designed to etch materials such as SiO2 and SiXNY. This RIE system operates at 13.56MHz and has one chamber that is used for etching of dielectric materials. This machine is not available for metal etching. A graphite plate is available to reduce temperature build up during a long process run. Small pieces up to 10" wafers are allowed in this system.

Location

Cleanroom - Marcus Inorganic

Oxford ICP PECVD

The Oxford ICP (Inductively Coupled Plasma) PECVD deposits a high-density, thin film under low temperatures and pressures (10mTorr or less). Instead of having parallel electrodes, this ICP PECVD has coiled electrodes, which results in high-density film. Only 4" wafers are allowed in this system.

Location

Cleanroom - Marcus Inorganic

Oxford PECVD right

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit SiO2 and SixNy materials. This PECVD has one chamber and medium deposition electrode that can hold samples sizes of up to a single 6" wafer. This machine operates at 13.56 Mhz and is designed to control the stress of deposited films by adjusting the ratio of He:N2 gas flows.

Location

Cleanroom - Marcus Inorganic

Peel Tester

The TMI Peel Tester performs 90 and 180 Degree peel test strength measurements for laminates and adhesives. It can measure up to 25 lb ft of force and accept samples up to 6" x 12" in size.

Location

Assembly Lab

Photolithography Training

Photolithography training will cover the fundamentals of photolithography, and operations involved in all the steps in photolithography. Trainer will do demo on the whole process including spin coating, baking, exposure, alignment, developing and inspection. Processing details will also be discussed during the training session.

Location

Cleanroom - Marcus Inorganic

Plasma-Etcher Plasma Cleaner

Plasma cleaner located in the Microscopy prep lab.

Location

Marcus Microscopy 1

PlasmaTherm ICP

An ICP (inductively coupled plasma) etcher (DRIE) can be used to etch a variety of materials. This ICP is equipped with two chambers -- one is dedicated to deep anisotropic silicon (BOSCH process) trench etching and the other is used for silicon dioxide and polymer etching. Wafer sizes 4" and 6" are allowed in the chambers.

Location

Cleanroom - Pettit

Plasma-Therm PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. This PECVD has two chambers. -Operates at 13.56 MHz -Sample size: pieces to 6" wafers -Typical deposition rates: 100 angstrom/min - 400 angstrom/min -Typical processes: Silicon Dioxide, Silicon Nitride, Silicon Oxynitride

Location

Cleanroom - Pettit

Plasma-Therm RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and has two chambers that are used for the etching of dielectrics and metals such as Al, Cr, and Ti. Small pieces up to 10" substrates are allowed in this system.

Location

Cleanroom - Pettit

Plasma-Therm SLR RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and etches III-V materials and metals such as Al, Cr, and Ti. Small pieces up to 10" substrates are allowed in this system.

Location

Cleanroom - Pettit

Plas-Mos Ellipsometer

The Plas-mos ellipsometer is used for measuring thicknesses of thin films such as oxides and nitrides.

Location

Cleanroom - Pettit

Plating Station 1

Plating station bench 1st power supply from the left.

Location

Cleanroom - Marcus Inorganic

Plating Station 2

Plating station bench 2nd power supply from the left.

Location

Cleanroom - Marcus Inorganic

Plating Station 3

Plating station bench 3rd power supply from the left.

Location

Cleanroom - Marcus Inorganic

Plating Station 4

Plating station bench 4th power supply from the left.

Location

Cleanroom - Marcus Inorganic

Location

Assembly Lab

PVD75 Filament Evaporator

The filament evaporator is used to coat samples with various metals. The PVD is a good choice for samples that need to be evaporator coated (to avoid coating the sides of rough topologies) but are sensitive to x-ray radiation from the E-beam. -Integrated touch screen control -Single substrate up to 12" diameter -Multiple substrate up to 4" diameter -Substrate fixture rotation up to 20 rpm Please note that it is possible to run gold on the system, however users need to bring their own gold pellets.

Location

Cleanroom - Marcus Inorganic

PVD75 RF Sputterer

The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating ions or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. -Sputter two or more dissimilar materials simultaneously for complete control of film stoichiometry (co-deposition) -Max RF power 325W -Integrated touch screen control -Single substrate up to 12" diameter -Multiple substrate up to 4" diameter -Substrate fixture rotation up to 20rpm

Location

Cleanroom - Marcus Inorganic

PVD Filament Evaporator (Instructional Lab)

PVD Filament Evaporator in the Pettit Instructional Lab

Location

Cleanroom - Pettit

Q-sense QCM-D

The Q-Sense E4 Quartz Crystal Microbalance with Dissipation (QCM-D) is a four module instrument used to measure bulk-surface interactions for materials, chemistry, and life sciences research. A wide range of crystal surfaces are available for flexible immobilization of proteins, nucleotides, cells, and polymers. The provided modeling and analysis software enables quantification of viscosity, elasticity, and thickness of any soft film, while reaction kinetics can be extracted as well.

Location

Cleanroom - Marcus Organic

Quick Circuit 7000 PCB Milling Machine

The PCB mill can be used to cut out shapes in FR4 material and be used for routing PCB's and drilling vias in substrates up to 13" x 19"

Location

Assembly Lab

Raman Spectrometer

The Thermo Nicolet Almega XR Dispersive Raman Spectrometer features : - 2 Lasers 488 nm and 785 nm, with an option to vary their power from 1 to 100%. - High confocal depth resolution. - Multiple standard & long working distance objectives. - Darkfield/brightfield with optional transmission viewing. - High spatial resolution & sample mapping (fully automated spectral collection over a large area with 3D spectral image). - All microscope functions and experimental set up options are software controlled (Omnic 8.3 with Atlus viewer).

Location

Marcus Microscopy 4

Resonetics IR laser

Resonetics Q-switched Nd:Ylf 1047nm/524nm.This Resonetics Q-switched Nd:YLF laser can be operated at two different wavelengths (1047 nm or 524 nm) with a beam size at approximately 50 microns. Materials such as metals, PZT ceramics, permanent magnets, alumina, and silicon have been succesfully micromachined and used in a wide ranges of applications (microneedles, interdigitated and planar metal designs, sintered multi-layer alumina devices, metal welding, silicon device trimming,...).

Location

Lab - Pettit 161

Samco UV Ozone Dry Stripper

The Samco model UV-1 is a stripper/cleaner used for cleaning or stripping organic materials such as solvent residues, photoresist, ink, or polyimide from substrate materials. The system accomplishes this with a combination of UV light, ozone, and heat.

Location

Cleanroom - Marcus Inorganic

Schmid APCVD

The Schmid APCVD is an atmospheric pressure roller furnace designed to deposit phosphorous or boron doped SiO2, undoped SiO2, and Al2O3. A second chamber is available for in-situ SiO2 encapsulation immediately after the initial deposition layer. <br> <br> Specifications: <br>- up to 550C process temperature <br>- up to 6" square samples (up to 0.20"/5.0mm thick) <br>- typically 24-48 in/min roller speed

Location

Cleanroom - Marcus Inorganic

SCS G3P8 Spin Coater 1 (small pieces)

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches.

Location

Cleanroom - Marcus Inorganic

SCS G3P8 Spin Coater 2 - Pettit

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches.

Location

Cleanroom - Pettit

SCS G3P8 Spin Coater 3 - Inorganic

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches.

Location

Cleanroom - Marcus Inorganic

SCS G3P8 Spin Coater - Instructional Center

The SCS G3P8 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches

Location

Cleanroom - Pettit

SCS G3P8 Spin Coater - Pettit

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches.<br><br> <a href="/processing/shipley/">Shipley Co., Inc. Photoresists</a><br> <a href="/processing/az/">AZ Electronic Materials Photoresists</a><br> <a href="/processing/futurrex/">Futurrex, Inc. Photoresists</a>

Location

Cleanroom - Pettit

SCS G3P8 Spinner - Soft-lithography

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for wafers or pieces 1-4 inches.

Location

Cleanroom - Marcus Organic

SCS Parylene Coater

The SCS Labcoter PDS 2010 is a vacuum system used for conformal vapor deposition of Parylene at room temperature. Typical deposition thicknesses range from 1um to 50um. Parylene-C and Parylene-N dimers are provided.<br> <br> Applications:<br> -chemical barrier<br> -moisture barrier<br> -structural material<br> -good dielectric<br> -bio-compatible/bio-stable<br>

Location

Lab - Pettit 160

Semiautomatic Screen Printer

Semiautomatic Screen Printer for depositing solder paste and similar materials. Screens must be designed and supplied by the user.

Location

Assembly Lab

Semi-Automatic Wire Bonder

For process development, production, research or added manufacturing support, K&S 4500 Series Manual Wedge Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: •Optoelectronic Modules •Hybrid/MCMs •Microwave Products •Discrete Devices/Lasers •Chip-on-Board Semi-automatic and manual operation modes, individual bond parameter control, and capacity for a wide range of wire diameters enable ease of use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.

Location

GEDC

SemiTest SCA-2500 Surface Charge Analyzer

The surface charge analyzer is used as a quality monitor for measuring surface charge on films such as silicon dioxide.

Location

Cleanroom - Pettit

Semitool Spin Rinse Dryer -- Instructional Center

The spin-rinse-dryer is equipped for cleaning four-inch silicon wafers. It spins the wafers and uses deionized water and nitrogen to clean and dry the wafers.

Location

Cleanroom - Pettit

Location

Cleanroom - Pettit

Signatone Four-point Probe

The Signatone Four Point Probe measures sheet resistivity on both blank wafers and wafers with a thin layer. The probe measures resistivity less than 1 ohm.

Location

Cleanroom - Pettit

Location

Cleanroom - Marcus Inorganic

Soft-Lithography Training

Soft-Lithography Training is composed of the training of basic skills in SU-8 master mold fabrication, equipment usage, and technical details discussion. Training is carried out in Marcus Organic Cleanroom, soft-lithography bay.

Location

Cleanroom - Marcus Organic

Solder Reflow Oven

5 zone reflow oven with inert atmosphere for oxidation-free soldering.

Location

Assembly Lab

Location

Cleanroom - Marcus Inorganic

Location

Cleanroom - Marcus Inorganic

SSI RTP

The SSI RTP system is a rapid temperature processing system for up to 4" wafers. <br><br> Specs:<br><br> -max. allowable temp: 900C (contact staff for 901C-1100C)<br><br> -N2 / Air / O2 available<br><br> -10 SLM (10,000 sccm) range MFCs<br><br> -up to 80C/s ramp rate<br><br>

Location

Cleanroom - Marcus Inorganic

STS AOE ICP

The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS' well-established Inductively Coupled Plasma (ICP) technology. The AEO source is originally conceived to overcome the limitations of conventional high density plasma sources for SiO2 deep etch applications. It is also proven to be suitable for deep etching of quartz, pyrex, and fused silica for 4" substrates and 6" substrates by request.

Location

Cleanroom - Pettit

STS HRM ICP

The STS HRM is a CMOS-Compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching for 4" or 6" silicon (DRIE) and SOI wafers and a high etch rate. Non-CMOS-compatible materials and masks are NOT allowed in this tool.

Location

Cleanroom - Marcus Inorganic

STS ICP

The STS ICP is a CMOS-compatible tool used for integrated MEMS-CMOS processes, and is meant for narrow (<10 micron in width) high aspect-ratio trench etching (DRIE) in silicon and SOI wafers. This system is used only for etching high aspect-ratio trenches in silicon (BOSCH process) and 4" SOI wafers.

Location

Cleanroom - Pettit

STS PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. -Large deposition electrode: pieces up to a single 6" wafer -Programmable dual frequency operation for precise stress control -Reproducible film properties

Location

Cleanroom - Pettit

STS PECVD 2

A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) induced plasma to deposit dielectric materials. It has a large deposition electrode that can hold sample sizes from small pieces up to a single 6" wafer and a programmable dual frequency operation for precise stress control. Reproducible film properties.

Location

Cleanroom - Pettit

STS PECVD 3

A PECVD process reacts gases in a RF (radio frequency) induced plasma to deposit materials such as silicon dioxide and silicon nitride. -Large deposition electrode: up to 5 - 3", 4 - 4" wafers or a single 6" wafer

Location

Cleanroom - Marcus Inorganic

STS Pegasus ICP

The STS Pegasus ICP is a deep reactive ion etcher (DRIE) with a dual plasma source design. It is designed to etch silicon through a Bosch Process. The process allows the sample to have a more uniform, anisotropic etch on 4" wafers. The STS Pegasus ICP is unique and provides users with high etch rates, excellent uniformity, and results in a highly concentrated and uniformed distribution of radicals.

Location

Cleanroom - Pettit

STS SOE ICP

STS SOE system combines a high conductance, high vacuum compatible process chamber with a patented ICP source to produce a very high ion density at low pressures. With this technology, STS ICP Standard Oxide Etcher is suitable for shallow etching (less than 15 micron trenches) of SiO2 and III-V materials that require higher etch rates, higher aspect ratios, and better selectivity compared to using conventional RIE technology on 4" wafers.

Location

Cleanroom - Pettit

Sulfurization furnace

The sulfurization furnace is used to deposit sulfur at high temperatures. The tool is setup to inject sulfur into the chamber then allow the sulfur to soak, covering all substrates. There is a turbo pump installed on the system to allow for low base and process pressure and good process control. The maximum temperature is 1050 C with a max ramp rate of 120 C/min. Gases available are argon, hydrogen, and methane.

Location

Cleanroom - Marcus Inorganic

Surrey CNT NanoGrowth

Surrey system.

Location

Cleanroom - Marcus Inorganic

Suss AltaSpray Spray Coater

SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more.

Location

Cleanroom - Marcus Inorganic

Suss MJB4

The MJB4 offers only 365nm wavelength light from a mercury lamp for the exposure illumination. The aligner performs exposures in vacuum (vacuum between substrate and mask), low vacuum (vacuum level between substrate and mask can be adjusted), hard (nitrogen pressure under the substrate), soft (vacuum under the substrate) contacts, and flood exposure (require with or without a mask). Line space resolution up to 0.8 micron can be achieved under optimum conditions in the vacuum mode, up to 1 micron for hard contact and up to 2 microns for soft contact. The size of substrates are ranging from small samples to 3 or 4 in wafers.

Location

Cleanroom - Marcus Organic

SWC 3000-C Mask Cleaner

SWC 3000-C Mask Cleaner

Location

Cleanroom - Marcus Inorganic

Location

Cleanroom - Pettit

Location

Cleanroom - Marcus Organic

Tencor P15 Profilometer

The KLA Tencor P15 is a robust, programmable stylus profiler system that provides 2D and 3D topographic measurements. <br> <br> Specifications:<br> -364um max step height<br> -6" sample or smaller<br> -2um radius, 60 degree tip

Location

Cleanroom - Pettit

Tencor P15 Profilometer (left)

The KLA-Tencor P-15 profiler is a highly sensitive surface profiler that measures step height and stress on a wafer surface. <br> <br> Specifications:<br> -327um max step height<br> -6" sample or smaller

Location

Cleanroom - Marcus Inorganic

Tencor P15 Profilometer (right)

The KLA-Tencor P-15 profiler is a highly sensitive surface profiler that measures step height and stress on a wafer surface. <br> <br> Specifications:<br> -131um max step height<br> -6" sample or smaller<br> -film stress measurement<br>

Location

Cleanroom - Marcus Inorganic

Thermo K-Alpha XPS

X-ray Photoelectron Spectroscopy (XPS) is an analytical technique that directs a monochromatic beam of x-rays onto a sample and detects the characteristic electrons that are ejected. The energies and number of these electrons can be used to determine not only the elements present on the sample surface, but their abundance and chemical bonding state as well. Elements from Li to U can be detected. The technique is highly surface sensitive – the typical detection depth is ~5 nm – and can detect light elements such as Si (Z =14) and below at about 1% of the total surface composition and heavier elements down to ~0.1 % with an accuracy of 20 – 50 percent of the given value.

Location

Marcus Microscopy 2

Location

Cleanroom - Marcus Inorganic

Thermo XPS Storage

Lockable storage container associated with the Thermo XPS.

Location

Marcus Microscopy 1

Tousimis Super Critical Dryer

The Autosamdri 815B is an Automatic Super-critical Point Dryer that has an efficient adiabatic cooling system and is capable of cooling the chamber from ambient room temperature to near 0°C, in less than 3 minutes. It maintains temperature automatically during both FILL and PURGE modes and processes up to 5-4" wafers at a time.

Location

Cleanroom - Pettit

Tousimis Super Critical Dryer

The Autosamdri 815B is an Automatic Super-critical Point Dryer that has an efficient adiabatic cooling system and is capable of cooling the chamber from ambient room temperature to near 0°C, in less than 3 minutes. It maintains temperature automatically during both FILL and PURGE modes and processes up to 5-6" wafers at a time.

Location

Cleanroom - Marcus Inorganic

Tystar Nitride Furnace 1

The Tystar Nitride Furnace 1 is used for N-type doping, Polysilicon doping (N-type) with solid (PhosPlus) sources. N2 is available.<br> <br> Common recipes:<br> NDOPCOMM.001 at 1050C<br> NANNEAL.001

Location

Cleanroom - Pettit

Tystar Nitride Furnace 2

The Tystar Nitride Furnace 2 is used for P-type doping, polysilicon doping (P-type) with solid source (BoronPlus) sources. N2 is available.<br> <br> Common recipes: <br> PDOPCOMM.002 at 1050C<br> PANNEAL.002

Location

Cleanroom - Pettit

Tystar Nitride Furnace 3

The Tystar Nitride Furnace 3 is used for Padox, Well, Field (LOCOS) oxide, wet oxidation growth. Wet oxidation steam is created from the combustion of H2 and O2 (a pyrogenic process). Max 1100C. N2, O2, and H2 are available.

Location

Cleanroom - Pettit

Tystar Nitride Furnace 4

The Tystar Nitride Furnace 4 is used for LPCVD silicon nitride, including stoichiometric silicon nitride and low stress silicon nitride. N2, DCS, and NH3 are available. <br> <br> Common recipes:<br> NITRCOMM.004<br> LSNITRID.004 (Deposition rate: 3.46 nm/min, n=2.28 (Nov 3,2014))<br> <br> Max process temperature: 850C.

Location

Cleanroom - Pettit

Tystar Poly Furnace 1

The Tystar Poly Furnace 1 is used for LTO/implantation anneal. N2 and H2 gases are available (H2 will ONLY flow WITH N2 for combustion safety).

Location

Cleanroom - Pettit

Tystar Poly Furnace 2

The Tystar Poly Furnace 2 is used for Kooi, P-well drive, and dry, and wet oxidation. Wet oxidation steam is created from the combustion of H2 and O2 (a pyrogenic process). N2, O2, and H2 are available.

Location

Cleanroom - Pettit

Tystar Poly Furnace 3

The Tystar Poly Furnace 3 is used for polysilicon (undoped and N-doped) deposition at a low pressure (250 mT) and low temperature (588C) with silane (SiH4) and phosphine (PH3). <br> <br> Common process recipes:<br> POLYCOM.007<br> DPOLY.007<br> STBY.007<br> <br> Max process temperature is 750C.

Location

Cleanroom - Pettit

Tystar Poly Furnace 4

The Tystar Poly Furnace 4 is used for polysilicon (undoped and P-doped) deposition at a low pressure (250 mT) and low temperature (588C) with silane (SiH4) and diborane (B2H6).<br> <br> Common process recipes:<br> POLYCOM.008<br> BDPOLY.008<br> STBY.008<br> <br> Max process temperature is 750C.

Location

Cleanroom - Pettit

Ultratech Plate Cleaner

The Ultra-Tech plate cleaner can be used to automatically clean photolithography masks.

Location

Cleanroom - Pettit

Unaxis PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced plasma to deposit dielectric materials. This PECVD has one chamber and large deposition electrode that can hold samples sizes of up to 5-3", 4-4" wafers or a single 6" wafer. This machine operates at 13.56 Mhz and is designed to control the stress of deposited films by adjusting the ratio of He:N2 gas flows.

Location

Cleanroom - Pettit

Unaxis RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and various metals using reactive gases in a RF (radio frequency) reactive ion plasma. This RIE system operates at 13.56 MHz and etches metals such as Al, Cr, and Ti. Small pieces up to 10" wafers are allowed in this system.

Location

Cleanroom - Marcus Inorganic

Unifilm Sputterer

The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. -Process wafers up to 4" -Deposition Processes: Aluminum, Aluminum/Silicon, Gold, Titanium, Copper, Chromium, Molybdenum, Molybdenum/Copper, Nickel, Silicon, Tantalum -DC/RF power

Location

Cleanroom - Marcus Inorganic

Unifilm Storage Box Left

Left storage box for metal targets for the Unifilm Sputterer

Location

Cleanroom - Marcus Inorganic

Unifilm Storage Box Right

Right storage box for metal targets for the Unifilm Sputterer

Location

Cleanroom - Marcus Inorganic

UV-VIS Spectrophotometer

Measures the optical Transmission T=I/Io (or Absorbance A=-logT) of either liquid or solid samples. Wavelength range is 190-1100 nm.

Location

Cleanroom - Marcus Organic

Veeco AFM

The Dimension 3100 Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques to measure surface characteristics for semiconductor wafers and other samples up to 200 mm in diameter.

Location

Marcus Microscopy 4

Veeco AFM II Dimension 3100

Veeco AFM 2 in Pettit 161

Location

Marcus Microscopy 2

Veeco Four-point Probe -- Instructional Center

The four point probe measures the resistive properties of semiconductor wafers and resistive films: V/I, Sheet or slice resistivity, metalization thickness and P-N type testing.

Location

Cleanroom - Pettit

Veeco NT3300

To be filled out by Jie Xu

Location

Cleanroom - Marcus Organic

Verteq Spin Rinse Dryer -- Instructional Center

The Verteq spin rinse dryer is a drying system that uses centrifugal forces to dry the surface of a substrate. The liquid on the substrate surface is spun off and drained from the bowl while liquid droplets on the drying chamber surfaces are evaporated.

Location

Cleanroom - Pettit

Vision RIE 1

The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch dielectric materials and shallow silicon by using SF6 as an etching gas. The Vision RIE has a permanent graphite plate in order to reduce temperature build up during a long process run. Small pieces up to 10" substrates are allowed in this system.

Location

Cleanroom - Pettit

Vision RIE 2

The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch dielectric materials and shallow silicon by using SF6 as an etching gas. The Vision RIE has a permanent graphite plate in order to reduce temperature build up during a long process run.

Location

Cleanroom - Marcus Inorganic

VWR Oven

Vacuum Oven located in the Microscopy prep lab.

Location

Marcus Microscopy 1

VWR Oven

Vacuum ovens are used for a wide variety of vacuum drying, curing, and moisture content testing. common applications include drying heat sensitive samples, moisture determination, and drying samples under a controlled atmosphere.

Location

Cleanroom - Marcus Inorganic

VWR Oven

To be filled out by Jie Xu

Location

Cleanroom - Marcus Organic

Location

Cleanroom - Pettit

Woollam Ellipsometer

Determines the film thickness and optical properties of a sample. The data is obtained by measuring the change in polarization state of light that occurs when light is reflected off the surface of (or transmitted through) a sample.

Location

Cleanroom - Pettit

Woollam M2000 Ellipsometer

M2000 Ellipsometer

Location

Cleanroom - Marcus Inorganic

Woollam Vase Ellipsometer

Combines high accuracy and precision with a wide spectral range up to 193 to 2500nm. Variable wavelength and angle of incidence allow flexible measurement capabilities.

Location

Cleanroom - Marcus Inorganic

Wyko Profilometer NT3300

The Veeco noncontact profilometer uses the phase change of light reflecting from various heights of similar materials to measure the uniformity of a flat surface or the horizontal distance between two adjacent surfaces. <br> <br> Features:<br> -motorized objectives<br> -motorized stage (tip/tilt & x/y/z)<br> -upgraded Veeco 'Vision' software w/ additional features<br>

Location

Cleanroom - Marcus Inorganic

Wyko Profilometer NT3300

The Wyko NT3300 noncontact profilometer measures the surface profile of a sample by using the phase change of light reflection and vertical scanning. Features: -motorized objectives -upgraded Veeco 'Vision' software w/ additional features

Location

Cleanroom - Marcus Organic

Xactix Xenon Difluoride Etcher

This tool uses xenon difluoride gas sent through a showerhead to isotropically dry etch silicon, germanium, and molybdenum. It can process pieces up to 4" wafers and generates relatively rough isotropically etched features.

Location

Cleanroom - Marcus Inorganic

YES-R1 Plasma Cleaner

The Plasma Cleaner uses an active ionized gas (plasma) in a low pressure environment to descum and remove residual organics and thin oxides from samples. -typical chamber temperature 25C-80C (heat from plasma) -little to no turbulence -Ar or O2 gas -sample size can vary from small pieces to 12inx12inx4in

Location

Cleanroom - Pettit

Zeiss Ultra60 FE-SEM

The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on large delicate specimems or uncoated wafers. The ULTRA 60 enables clear topographic imaging with the high efficiency In-lens SE detector. Ultra high resolution imaging at low kV Extra large 6-axes motorised fully eucentric stage with fine stage control Large sample throughput with integrated 8" airlock High efficiency In-lens SE detector for high contrast surface imaging download SmartTIFF: http://grover.mirc.gatech.edu/SmartTiffInstaller.exe to let you do measurements on your images

Location

Marcus Microscopy 3