Equipment Classification

ALD2

The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD2 uses 4...Details

Cambridge NanoTech Plasma ALD - Metal (left)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-hig...Details

Cambridge NanoTech Plasma ALD - Oxide (right)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-hig...Details

ALD2

The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material. The ALD2 uses 4...Details

Bioforce Nano eNabler Printer/Patterner

The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtol...Details

Cambridge NanoTech Plasma ALD - Metal (left)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-hig...Details

Cambridge NanoTech Plasma ALD - Oxide (right)

The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-hig...Details

CHA E-beam Evaporator 1 (dielectrics)

The e-beam evaporator will provide very little coating to the sides of any features that are perpend...Details

CHA E-beam Evaporator 2 (metals)

The e-beam evaporator will provide very little coating to the sides of any features that are perpend...Details

CVC DC Sputterer

The CVC DC sputterer is used to coat samples with metals. <br> <br> Specifications:<br> -wafers/s...Details

CVC E-Beam Evaporator 1

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporato...Details

CVC E-Beam Evaporator 2 -- Instructional Center

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporato...Details

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Denton Explorer - E-beam Evaporator

The Denton Explorer is a six pocket e-beam evaporator system used to coat samples with various metal...Details

Denton Infinity

The Denton Infinity is a six pocket e-beam evaporator system used to coat samples with various metal...Details

JetLabII Ink-jet Printer

This table-top ink-jet microdispensing and printing platform is useful for a wide variety of applica...Details

PVD75 Filament Evaporator

The filament evaporator is used to coat samples with various metals. The PVD is a good choice for sa...Details

PVD75 RF Sputterer

The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating io...Details

PVD Filament Evaporator (Instructional Lab)

PVD Filament Evaporator in the Pettit Instructional LabDetails

Schmid APCVD

The Schmid APCVD is an atmospheric pressure roller furnace designed to deposit phosphorous or boron ...Details

SCS Parylene Coater

The SCS Labcoter PDS 2010 is a vacuum system used for conformal vapor deposition of Parylene at room...Details

STS PECVD 2

A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) in...Details

Sulfurization furnace

The sulfurization furnace is used to deposit sulfur at high temperatures. The tool is setup to injec...Details

Tystar Nitride Furnace 4

The Tystar Nitride Furnace 4 is used for LPCVD silicon nitride, including stoichiometric silicon nit...Details

Unifilm Sputterer

The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. ...Details

Gasonics Asher

The Aura 1000 Asher is a microprocessor controlled downstream photoresist stripper that will strip t...Details

Gasonics Asher (Inorganic)

The Aura 1000 Asher is a microprocessor controlled downstream, or "afterglow", photoresist stripper ...Details

Hydrofluoric (HF) Vapor Etcher

The Hydrofluoric Vapor Etcher is used for the removal of oxide layers on samples. It has high etch r...Details

Oxford Cryogenic ICP

The Oxford Cryogenic ICP (Inductively Coupled Plasma) etching (DRIE) produces high ion densities a...Details

Oxford End-point RIE

An Oxford Endpoint RIE (Reactive Ion Etcher) system is designed to etch materials such as SiO2 and S...Details

PlasmaTherm ICP

An ICP (inductively coupled plasma) etcher (DRIE) can be used to etch a variety of materials. This I...Details

Plasma-Therm RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and...Details

Plasma-Therm SLR RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and...Details

STS AOE ICP

The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS' well-established Induc...Details

STS HRM ICP

The STS HRM is a CMOS-Compatible tool used for integrated MEMS-CMOS processes, and is meant for narr...Details

STS ICP

The STS ICP is a CMOS-compatible tool used for integrated MEMS-CMOS processes, and is meant for narr...Details

STS Pegasus ICP

The STS Pegasus ICP is a deep reactive ion etcher (DRIE) with a dual plasma source design. It is des...Details

STS SOE ICP

STS SOE system combines a high conductance, high vacuum compatible process chamber with a patented I...Details

Unaxis RIE

RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and...Details

Vision RIE 1

The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch dielec...Details

Vision RIE 2

The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system. It is used to etch dielec...Details

Xactix Xenon Difluoride Etcher

This tool uses xenon difluoride gas sent through a showerhead to isotropically dry etch silicon, ger...Details

CVD FirstNano SiGe Nanowire Furnace

The SiGe Nanowire furnace is configured for depositing Si nanowires from metal nanoparticles such as...Details

FEI Nova Nanolab 200 FIB/SEM

The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool. It combines ult...Details

FEI Quanta 200 3D FIB/SEM

The Quanta 3D is designed to be a 3D-SEM. It combines traditional thermal emission Scanning Electron...Details

Hitachi HD-2700 200kV STEM

The Hitachi HD-2700 200kV STEM can image samples at 80kV, 120kV, and 200kV. It has a unique seconda...Details

Hitachi HD-2700 200kV STEM

The Hitachi HD-2700 200kV STEM can image samples at 80kV, 120kV, and 200kV. It has a unique seconda...Details

Hitachi HT7700 TEM

The HT7700 is a highly advanced Transmission Electron Microscope developed for imaging both biologic...Details

Hitachi S-3500H SEM

The Hitachi 3500H series scanning electron microscope offers high resolution imaging in a vacuum.Details

Hitachi S-3700N VP-SEM

The Hitachi S-3700N Variable Pressure SEM features a low vacuum observation of 6–270 Pa (7mT-2Torr)...Details

Hitachi S-4700 FE-SEM

The Hitachi S-4700 FE-SEM is a cold field emission high resolution scanning electron microscope. Thi...Details

LEO 1530 FE-SEM

The LEO 1530 FE-SEM is a hi-resolution SEM capable of sub-nanometer resolution. Detectors: In-L...Details

Zeiss Ultra60 FE-SEM

The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on ...Details

BLE Spinner

The BLE Photoresist Spinner is a spinner/hot plate combo mounted inside of a white polypropylene b...Details

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The MJB4 offers only 365nm wavelength light from a mercury lamp for the exposure illumination. The a...Details

EVG 101 Spin Coater

The EVG101 Spin Coater is a teflon body, automatic Shipley 1827 resist spin coater. It offers furthe...Details

EVG 620 Mask Aligner

The EVG 620 Mask aligner is configured for top and backside alignment. It has a manual cassette load...Details

Karl Suss MA-6 Mask Aligner - Inorganic

Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photore...Details

Karl Suss MA-6 Mask Aligner - Pettit

Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photore...Details

Karl Suss RC8 Spinner - Inorganic

The RC8 programmable process spinner is reserved for photoresist use. Spin coatings of other materi...Details

Karl Suss RC8 Spinner - Pettit

The RC8 programmable process spinner is reserved for photoresist use. Spin coatings of other materi...Details

Karl Suss TSA MA-6 Mask Aligner

The Karl Suss TSA MA6 Mask Aligner offers high quality exposure optics for high resolution and optim...Details

SCS G3P8 Spin Coater 1 (small pieces)

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This...Details

SCS G3P8 Spin Coater 2 - Pettit

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This...Details

SCS G3P8 Spin Coater 3 - Inorganic

The SCS G3 Spin Coater series accurately applies liquid coating materials on planar substrates. This...Details

Suss AltaSpray Spray Coater

SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that i...Details

CHA E-beam Evaporator 1 (dielectrics)

The e-beam evaporator will provide very little coating to the sides of any features that are perpend...Details

CHA E-beam Evaporator 2 (metals)

The e-beam evaporator will provide very little coating to the sides of any features that are perpend...Details

CVC E-Beam Evaporator 1

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporato...Details

CVC E-Beam Evaporator 2 -- Instructional Center

The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporato...Details

Denton Explorer - E-beam Evaporator

The Denton Explorer is a six pocket e-beam evaporator system used to coat samples with various metal...Details

Denton Infinity

The Denton Infinity is a six pocket e-beam evaporator system used to coat samples with various metal...Details

Electroless Plating Line

The Electroless Plating Line provides chemical desmear process and electroless copper plating of 300...Details

PVD75 Filament Evaporator

The filament evaporator is used to coat samples with various metals. The PVD is a good choice for sa...Details

PVD75 RF Sputterer

The RF sputterer can be used to deposit many dielectrics. Coatings are performed by accelerating io...Details

PVD Filament Evaporator (Instructional Lab)

PVD Filament Evaporator in the Pettit Instructional LabDetails

Unifilm Sputterer

The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. ...Details

Bowoptic Stress Measurement

The BowOptic 208 is an automatic wafer stress measurement machine that uses a proven accurate method...Details

Contact Angle Measurement System

The Ramé-hart Model 250 goniometer is a software-driven instrument providing automated digital conta...Details

Dage X-Ray XD7600NT

The Dage X-Ray XD7600NT provides the highest resolution and largest X-ray images for failure analysi...Details

Hitachi HD-2700 200kV STEM

The Hitachi HD-2700 200kV STEM can image samples at 80kV, 120kV, and 200kV. It has a unique seconda...Details

Hitachi HD-2700 200kV STEM

The Hitachi HD-2700 200kV STEM can image samples at 80kV, 120kV, and 200kV. It has a unique seconda...Details

Hysitron TriboIndenter

The TriboIdenter is used to measure the hardness and elastic modulus of thin films and coatings.Details

IONTOF Time-of-Flight SIMS

The ToF-SIMS system uses Bi ions to directly chemically image surfaces. Sputtering by O or Cs ion b...Details

Kratos XPS

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Malvern Zetasizer

The Malvern Instruments Zetasizer Nano ZS uses light scattering techniques to measure hydrodynamic s...Details

Nanospec Reflectometer - Inorganic

The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectrosc...Details

Nanospec Reflectometer - Pettit

The NanoSpec 3000 is a film thickness measurement system that utilizes a modern small spot spectrosc...Details

Olympus LEXT 3D Material Confocal Microscope

Material confocal microscope with fixed laser wavelength of 405nm with magnification ranges: 108x – ...Details

Olympus LEXT 3D Material Confocal Microscope (removed)

Material confocal microscope with fixed laser wavelength of 405nm with magnification ranges: 108x – ...Details

Q-sense QCM-D

The Q-Sense E4 Quartz Crystal Microbalance with Dissipation (QCM-D) is a four module instrument used...Details

Raman Spectrometer

The Thermo Nicolet Almega XR Dispersive Raman Spectrometer features : - 2 Lasers 488 nm and 785 nm...Details

Tencor P15 Profilometer

The KLA Tencor P15 is a robust, programmable stylus profiler system that provides 2D and 3D topograp...Details

Tencor P15 Profilometer (left)

The KLA-Tencor P-15 profiler is a highly sensitive surface profiler that measures step height and st...Details

Tencor P15 Profilometer (right)

The KLA-Tencor P-15 profiler is a highly sensitive surface profiler that measures step height and st...Details

Thermo K-Alpha XPS

X-ray Photoelectron Spectroscopy (XPS) is an analytical technique that directs a monochromatic beam ...Details

UV-VIS Spectrophotometer

Measures the optical Transmission T=I/Io (or Absorbance A=-logT) of either liquid or solid samples. ...Details

Veeco AFM

The Dimension 3100 Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) ...Details

Woollam Ellipsometer

Determines the film thickness and optical properties of a sample. The data is obtained by measuring ...Details

Woollam Ellipsometer

Determines the film thickness and optical properties of a sample. The data is obtained by measuring ...Details

Woollam M2000 Ellipsometer

M2000 EllipsometerDetails

Abrasive Blast Cabinet

This cabinet is used to roughen samples for adhesive promotion or material removal. It is to be used...Details

BGA Rework Station

This tool is used to rework soldered flip chips. It has rough alignment and placement capabilities ...Details

Dage Shear Tester

The Dage Shear Tester is used primarily to test flip chip bonds by shearing off the bonded die. Thi...Details

Finetech Sub-micron Flip-chip Bonder

The Finetech Fineplacer Lambda is a very high precision flip-chip bonder that has the following feat...Details

Jet Dispenser

CNC jet dispense tool for printing solder pastes, flux, underfill, or any other liquid or gel materi...Details

K&S 4522 Ball Bonder

Semi automatic gold ball wire bonder. Currently set up with 25 um gold wire with a ball size of abo...Details

K&S 4523A Wedge Wire Bonder

Aluminum wire wedge bonder. Provides digital controls with semiautomatic bonding cycle, but manual ...Details

K&S Manual Wire Bonder Pettit 160

25 micron gold ball wirebonderDetails

Manual Flip Chip Bonder

This flip chip bonder is currently only for PRC use. It can perform thermocompression, thermosonic,...Details

MEI ball bonder

Gold Ball bonder - ManualDetails

Peel Tester

The TMI Peel Tester performs 90 and 180 Degree peel test strength measurements for laminates and adh...Details

Quick Circuit 7000 PCB Milling Machine

The PCB mill can be used to cut out shapes in FR4 material and be used for routing PCB's and drillin...Details

SCS Parylene Coater

The SCS Labcoter PDS 2010 is a vacuum system used for conformal vapor deposition of Parylene at room...Details

SEC 850 Flip-chip Bonder

The SEC850 is an easy-to-use manual flip-chip bonding/placement system. The placement accuracy of th...Details

Semiautomatic Screen Printer

Semiautomatic Screen Printer for depositing solder paste and similar materials. Screens must be des...Details

Solder Reflow Oven

5 zone reflow oven with inert atmosphere for oxidation-free soldering.Details

Black Magic PECVD

AIXTRON’s PECVD system uses rapid heating and plasma technologies that have been proven in the field...Details

Oxford ICP PECVD

The Oxford ICP (Inductively Coupled Plasma) PECVD deposits a high-density, thin film under low tempe...Details

Oxford PECVD left

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced pl...Details

Oxford PECVD right

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced pl...Details

Plasma-Therm PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced pl...Details

STS PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) in...Details

STS PECVD 3

A PECVD process reacts gases in a RF (radio frequency) induced plasma to deposit materials such as s...Details

Unaxis PECVD

A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced pl...Details

AET RTP

Rapid thermal processors (RTP) or rapid thermal annealers (RTA) are used to rapidly heat a sample fo...Details

CVD FirstNano Graphene Furnace 1

The CVD FirstNano Graphene furnace is currently configured for graphene on Cu foil, graphene sublima...Details

CVD FirstNano SiGe Nanowire Furnace

The SiGe Nanowire furnace is configured for depositing Si nanowires from metal nanoparticles such as...Details

Heraeus Vacuum Oven - Inorganic

The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C unde...Details

Heraeus Vacuum Oven - Pettit

The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C unde...Details

JetFirst RTP

The JetFirst RTP system is a rapid temperature processing system for up to 4" wafers. Specs: -ra...Details

Lindberg Furnace

The Lindberg furnaces are used for curing polymers, sintering, and growing oxides and nitrides on si...Details

Lindberg Furnace 1 (CMOS Sintering Tube)

The Lindberg furnace tube 1 is used for curing polymers, sintering, and growing oxides and nitrides ...Details

Lindberg Furnace 2 (Polymer Curing Tube)

The Lindberg furnace tube 2 is used for curing polymers, sintering, and growing oxides and nitrides ...Details

Lindberg Furnace 3 (Oxidation Tube)

The Lindberg furnace tube 3 is used for curing polymers, sintering, and wet/dry oxidation and nitrid...Details

Lindberg Furnace 4 (Polymer Curing Tube)

The Lindberg furnace tube 4 is used for curing polymers, sintering, and growing oxides and nitrides ...Details

Mini Tystar Tube 1

The Mini Tystar 1 is primarily used for wet oxidation at temperatures between 700-1100°C with a flas...Details

Mini Tystar Tube 2

The Mini Tystar 2 is used for dry and wet oxidation at temperatures between 700-1100°C. Wet oxidati...Details

Mini Tystar Tube 4

Marcus Inorganic Mini Tystar - bottom tube (no tube at the moment)Details

MRL Furnace - Tube 1

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MRL Furnace - Tube 2

MRL Furnace - Tube 2Details

MRL Furnace - Tube 3

MRL Furnace 3 is used for dry oxidation at temperatures between 700 -1150°C. Batches of up to 50 wa...Details

MRL Furnace - Tube 4

MRL Furnace 4 is used for annealing only at temperature between 700-1150°C with batches of up to 50 ...Details

Schmid APCVD

The Schmid APCVD is an atmospheric pressure roller furnace designed to deposit phosphorous or boron ...Details

SSI RTP

The SSI RTP system is a rapid temperature processing system for up to 4" wafers. <br><br> Specs:<b...Details

Sulfurization furnace

The sulfurization furnace is used to deposit sulfur at high temperatures. The tool is setup to injec...Details

Tystar Nitride Furnace

TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes em...Details

Tystar Nitride Furnace 1

The Tystar Nitride Furnace 1 is used for N-type doping, Polysilicon doping (N-type) with solid (Phos...Details

Tystar Nitride Furnace 2

The Tystar Nitride Furnace 2 is used for P-type doping, polysilicon doping (P-type) with solid sourc...Details

Tystar Nitride Furnace 3

The Tystar Nitride Furnace 3 is used for Padox, Well, Field (LOCOS) oxide, wet oxidation growth. Wet...Details

Tystar Nitride Furnace 4

The Tystar Nitride Furnace 4 is used for LPCVD silicon nitride, including stoichiometric silicon nit...Details

Tystar Poly Furnace 1

The Tystar Poly Furnace 1 is used for LTO/implantation anneal. N2 and H2 gases are available (H2 wil...Details

Tystar Poly Furnace 2

The Tystar Poly Furnace 2 is used for Kooi, P-well drive, and dry, and wet oxidation. Wet oxidation ...Details

Tystar Polysilicon Furnace

TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes em...Details

CMOS Cleaning Station (Marcus)

This fume hood has heated tanks: Piranha, SC2 cleans and dilute HF etch tank. These wet baths are ...Details

CMOS Cleaning Station (Pettit)

This fume hood has heated tanks: Piranha, SC1, SC2 cleans and Nitride etch tank. These wet baths a...Details

CMOS Spin Rinse Dryer (Inorganic)

Spin Rinse Dryer (SRD) is used for rinsing and drying full sized wafers in cassette, after cleaning ...Details

CMOS Spin Rinse Dryer - Pettit

The spin-rinse-dryer is equipped for cleaning 4-inch silicon wafers. It spins the wafers and uses de...Details

MEMS Wet Bench

MEMS wet bench.Details

Semitool Spin Rinse Dryer -- Instructional Center

The spin-rinse-dryer is equipped for cleaning four-inch silicon wafers. It spins the wafers and uses...Details

Verteq Spin Rinse Dryer -- Instructional Center

The Verteq spin rinse dryer is a drying system that uses centrifugal forces to dry the surface of a ...Details